BGA(CSP) cutting device
Removal of BGA (CSP) without thermal load!!
- It is possible to remove the IC while minimizing the effects of heat. - It is a tabletop-sized milling machine. - Teaching is simply specifying the two diagonal points of the IC and the depth (in automatic creation mode). It can be easily created with dedicated software and a controller. Height is automatically adjusted, so teaching is not necessary. It is also easier to prevent excessive cutting. - Switching cutting patterns is also simple. Positioning and warping correction jigs are required for each circuit board.
- Company：大宮工業 営業本部営業課
- Price：1 million yen-5 million yen
